events

June 7-11, 2010

E-MRS 2010 spring
Technical sessions:
June 7-11
Exhibit:
June 8-10
Congress Center, Strasbourg, France

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Aug. 29-Sept. 2, 2010

The 8th European Conference on Silicon Carbide and Related Materials
Oslo, Norway

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thinning

Before or after device processing for 2”, 3”.



• 2” and 3” wafers - 100µm, 50µm and less



• Thickness 50µm

services

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