events
June 7-11, 2010
E-MRS 2010 spring
Technical sessions:
June 7-11
Exhibit:
June 8-10
Congress Center, Strasbourg, France
Aug. 29-Sept. 2, 2010
The 8th European Conference on Silicon Carbide and Related Materials
Oslo, Norway
thinning
Before or after device processing for 2”, 3”.

• 2” and 3” wafers - 100µm, 50µm and less

• Thickness 50µm



