Polishing
Surface quality
Improve yields and device performance
(from as-cut or on commercial wafers for wafer manufacturers or users)
| SiC | AIN | GaN | Al2O3 | ZnO | Ge, CdTe, SiGe silice … | |
|---|---|---|---|---|---|---|
| Polishing | ✓ | ✓ | ✓ | ✓ | ✓ | ✓ |
Surface quality
| SiC | 4H(n-type and SI) on-axis − 8° off |
6H(n-type and SI) on-axis − 8° off |
4H - 6H a- & m-plane |
3C | ||
|---|---|---|---|---|---|---|
| Face | Si | C | Si | C | N/A | |
| RMS**(Å) | <1* | <1* | <1* | <1* | <1* | <5 |
| Other materials | AI2O3 c- & r-plane |
ZnO | AIN | GaN | |||
|---|---|---|---|---|---|---|---|
| Face | N/A | Zn | O | AI | N | Ga | N |
| RMS**(Å) | <1 - 2* | <1* | <1* | <3 | - | 1 - 2 | 1 |
* with atomic steps
** measured by AFM, field size 5µm x 5µm in tapping mode
