Polishing
Planarization
Polishing with low removal after device fabrication or annealing to improve surface morphology. Removal thickness as little as 1000Å.
| SiC | AIN | GaN | Al2O3 | ZnO | Ge, CdTe, SiGe silice … | |
|---|---|---|---|---|---|---|
| Planarization | ✓ | ✓ | ✓ |
Polishing with low removal after device fabrication or annealing to improve surface morphology. Removal thickness as little as 1000Å.
| SiC | AIN | GaN | Al2O3 | ZnO | Ge, CdTe, SiGe silice … | |
|---|---|---|---|---|---|---|
| Planarization | ✓ | ✓ | ✓ |